Semiconductor device having a gate insulating film structure including an insulating film containing metal, silicon and oxygen and manufacturing method thereof

ABSTRACT

Claimed and disclosed is a semiconductor device including a transistor having a gate insulating film structure containing nitrogen or fluorine in a compound, such as metal silicate, containing metal, silicon and oxygen, a gate insulating film structure having a laminated structure of an amorphous metal oxide film and metal silicate film, or a gate insulating film structure having a first gate insulating film including an oxide film of a first metal element and a second gate insulating film including a metal silicate film of a second metal element.

RELATED APPLICATION

This application claims priority to Japanese Application No. 2000-066960filed Mar. 10, 2000, incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention is directed to a semiconductor device and a manufacturingmethod of the semiconductor device. More particularly to a semiconductordevice having a gate insulating film structure including an insulatingfilm which contains metal, silicon and oxygen, for example, a metalsilicate film and the manufacturing method thereof.

2. Description of the Related Art

It is desirable to make a thin gate insulating film for theminiaturization of the Metal Insulator Semiconductor Field EffectTransistor (“MISFET”). If a thin silicon oxide film or siliconoxide-nitride film is used as the gate insulating film, a leak current,that is, a direct tunnel current is increased due to a reduction in thefilm thickness. As a result, the minimum thickness is approximately 2nm.

Therefore, it is proposed to suppress a leak current by using a metaloxide film or metal silicon-oxide film (hereinafter referred to as ametal silicate film) having a dielectric constant larger than that ofthe silicon oxide film. That is, when a metal silicate film or a metaloxide film is used as a gate insulating film, the film thickness forattaining an electrical characteristic equivalent to that of a siliconoxide film (“effective film thickness”) can be reduced.

However, when the metal oxide film is used as the gate insulating film,it is difficult to obtain a good interface which is free from distortionin a portion facing a silicon substrate. Additionally, when the metalsilicate film is used as the gate insulating film, a mediocre interfaceis attained, with a smaller dielectric constant than that of the metaloxide film.

It was postured to form a metal silicate film at the interface between asilicon substrate and a metal oxide film by heat treatment afterformation of the metal oxide film on the silicon substrate so as to forma laminated structure of the two films on the silicon substrate.Unfortunately, with time, the constituent metals of the two films becomethe same. Therefore, it is difficult to attain the best combination ofthe metal oxide film and metal silicate film by using different kinds ofthe constituent metals of the two films. Additionally, since metal oxidefilm is made of a crystalline metal oxide material, the effective filmthickness locally varies due to its dependency on the dielectricconstant of the crystal plane orientation.

The metal oxide film and metal silicate film are formed by a Chemicalvapor Deposition (“CVD”) method, but a metal oxide film formed by theCVD method has a composition slightly different from a stoichiometriccomposition and tends to become a coarse film with a low density.

When two MISFETs with different gate insulating film thickness areformed on the same semiconductor substrate, the process of forming ametal oxide film on the entire surface of the substrate, removing partof the metal oxide film on the gate region of one of the MISFETs whosegate insulating film is made thin and forming a metal oxide film on theentire surface of the resultant structure are required. Unfortunately,this process is complicated and inefficient.

Thus, using a metal oxide film or metal silicate film as an insulatingfilm a dielectric constant larger than that of a silicon oxide film isproposed. However, there are many problems in maintaining thecharacteristics of the gate insulating film while attaining thereduction in the physical and/or the actual film thickness.Specifically, problems with respect to the characteristic of theresulting elements and the productivity of manufacturing the elements.

OBJECT OF THE INVENTION

Accordingly, the object of the present invention is to solve theseproblems by providing a semiconductor device having a metal oxide filmor an insulating film containing metal, silicon and oxygen.Specifically, the present invention provides a metal silicate film as agate insulating film where the characteristics of the elements in asemiconductor device and the productivity of manufacturing miniaturesemiconductor device are enhanced and its manufacturing method thereof.

SUMMARY OF THE INVENTION

A semiconductor device according to present invention has a gateinsulating film including an insulating film with metal, silicon andoxygen, for example, a metal silicate film having at least one offluorine and nitrogen.

According to the object of the present invention, the dangling bond onthe interface between the metal silicate film and silicon that made upthe semi-conductor substrate can be brought to an end by fluorinecontained in the metal silicate film. Therefore, the interface statedensity can be lowered as compared to a metal silicate film withoutfluorine and a good interface characteristic is attained.

Further, the dielectric constant of the metal silicate film is increasedand the effective film thickness reduced when it contains nitrogen. Theannealing process for the metal oxide film is carried out under anoxidizing atmosphere (to compensate for oxygen deficiency) to avert theoxidizing reaction in the interface between the metal silicate film andsilicon which made up the semiconductor substrate. Thus, the effectivefilm thickness is reduced and good interfacial characteristic such as alow interface state density is attained.

Thus, a high performance transistor is produced by positioning ametal-containing metal silicate insulating film, having silicon, oxygen,and at least one fluorine and one nitrogen between the semiconductorsubstrate and the metal oxide film. The transistor thus produced has agood interfacial characteristic with a film gate insulating filmcontaining metal silicate film that has a reduced effective filmthickness and a reduced leak current.

A semiconductor device according to another aspect of the presentinvention has a gate insulating film constructed by laminating a metalsilicate insulating film having metal, silicon, and oxygen together withan amorphous metal oxide film. The gate insulating film having the metaloxide film and metal silicate film thus produced has a reduced effectivefilm thickness and a reduced leak current. Further, since the metaloxide film is an amorphous film, a transistor thus produced has areduced variation of the effective film thickness which depends on thedielectric constant of the crystal plan orientation and a less variationin the threshold voltage with excellent reliability.

Moreover, the metal oxide film in accordance with the present inventionis formed after formation of the insulating film with metal, silicon,and oxygen. This is contrary to the industrial practice of forming themetal, silicon and oxygen containing insulating film by heat treatmentafter the metal oxide film is formed. The metal constituent of the metaloxide film can be replaced from the main metal constituent of theinsulating film containing metal, silicon, and oxygen. Further, theinsulating film containing metal, silicon, and oxygen and the amorphousfilm of the metal oxide film can be obtained by changing the heattreatment to a lower temperature than the crystallization temperature ofthe insulating film containing metal, silicon, and oxygen and higherthan the crystallization temperature of the metal oxide film after theformation of the insulating film containing metal, silicon, and oxygenand before the formation of the metal oxide film.

Further, the present invention is a manufacturing method of asemiconductor device having a metal oxide film as one of a multi-layeredgate insulating film. The invention is characterized by effecting theheat treatment in an atmosphere containing a plurality of gases withdifferent oxidizing powers after the formation of the metal oxide filmon the semiconductor substrate. In other words, the different oxidizingpowers can be explained as different tendency for anoxidation-reduction.

Conditions for heat treatment are set to only oxidize the metalcontained in the metal oxide film without oxidizing silicon in theboundary region between the semiconductor substrate and the metal oxidefilm.

In this invention, the insulating film containing metal, silicon, andoxygen is termed “metal silicon-oxygen film” (metal silicate film).However, the metal silicon-oxygen film can be used when metal oxide andsilicon oxide are separated, as a mixture and when metal, silicon, andoxygen uniformly exist as a compound. Any of these uses described formetal silicate film are suitable in the present invention.

In this disclosure, “comprising”, “comprises” and the like can have themeaning ascribed to them in U.S. Patent Law and can mean “includes”,“including” and the like.

These and other embodiments will be described and/or will be obviousfrom the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a cross sectional view of a semiconductor device accordingto a first embodiment of the present invention;

FIG. 1B shows a cross sectional view of a semiconductor device accordingto a modification of the first embodiment of this invention;

FIGS. 2A to 2I show cross sectional views of each of the main portionsin each respective step of a manufacturing method of the semiconductordevice according to the first embodiment of this invention;

FIG. 3 shows a cross sectional view of a semiconductor device accordingto a second embodiment or a third embodiment of this invention;

FIGS. 4A to 4D show cross sectional views of each of the main portionsin each respective step of a manufacturing method of the semiconductordevices according to the second or this embodiment shown in FIG. 3;

FIGS. 5A to 5H show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a fourth embodiment of this invention;

FIG. 6 is an hydrogen-water vapor partial pressure equilibrium curve foroxidation of silicon (“SiO₂”) and gadolinium (“Gd₂O₃”) for selectiveoxidation in the manufacturing process of the fourth embodiment of thisinvention;

FIGS. 7A to 7F show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a fifth embodiment of this invention;

FIGS. 8A to 8C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a sixth embodiment of this invention;

FIGS. 9A to 9E show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a seventh embodiment of this invention;

FIGS. 10A to 10E show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to an eighth embodiment of this invention;

FIGS. 11A to 11C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a ninth embodiment of this invention;

FIGS. 12A to 12C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a tenth embodiment of this invention;

FIGS. 13A to 13C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to an eleventh embodiment of this invention;

FIGS. 14A to 14C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a twelfth embodiment of this invention;

FIGS. 15A to 15C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a thirteenth embodiment of this invention; and

FIGS. 16A to 16C show cross sectional views of each of the main portionsin each respective step of a manufacturing method of a semiconductordevice according to a fourteenth embodiment of this invention.

DETAILED DESCRIPTION OF THE INVENTION Embodiment 1

Without wishing to unnecessarily limit the foregoing, the followingshall discuss the invention with respect to certain preferredembodiments.

A first embodiment of this invention will now be described withreference to FIGS. 1A to 1B and 2A to 2I of the accompanying drawings.

FIG. 1A shows a structure of a semiconductor device according to thefirst embodiment of this invention.

A metal silicon-oxygen material film (hereinafter a “metal silicatefilm”) 6 (which is a zirconium silicate film in accordance with thisembodiment) as a compound of metal, silicon and oxygen, and a metaloxide film 3 (which is a zirconium oxide film in accordance with thisembodiment) are formed as a gate insulating film on a silicon substrate1. A titanium nitride film 4 is formed on metal oxide film 3 and atungsten film 5 is formed on titanium nitride film 4 so as to fill acavity formed on titanium nitride film 4 so that a multi-layered gateelectrode is formed on metal oxide film 3.

The film thickness of zirconium silicate film 6 is approximately 1.5 nm,the film thickness of zirconium oxide film 3 is approximately 3 nm, andthe film thickness obtained when the film thickness of each of the abovefilms 6 and 3 is expressed in terms of the film thickness of a siliconoxide film and that thickness is approximately 0.5 nm and the effectivegate insulating film thickness is approximately 1 nm. zirconium silicatefilm 6 disposed between the gate electrode and silicon substrate 1contains a small amount of fluorine. The width of the gate electrode isapproximately 50 nm.

The number of atoms for each unit volume is preferably set at about from1×10¹⁹ cm⁻³ to about 1×10²¹ cm⁻³ as the amount of fluorine contained inzirconium silicate film 6. The number of atoms are preferably at a peakconcentration of approximately from 5×10¹⁹ cm⁻³ to 5×10²⁰ cm⁻³ and in aposition of zirconium silicate film 6 near the interface of siliconsubstrate 1.

An effective amount of fluorine can be correct a distortion at thejunction portion between zirconium silicate film 6 and silicon substrate1 so as to improve the bond mismatching between zirconium silicate film6 and silicon substrate 1. In addition to Zirconium (“Zr”) silicatefilm, the metal in the metal silicate film 6 can be, but is not limitedto, hafnium (Hf) silicate film, lanthanum (La) silicate film, gadolinium(Gd) silicate film, yttrium (Y) silicate film, aluminum (Al) silicatefilm and titanium (Ti) silicate film. Further, it is possible to use ametal silicate film containing two or more of the above metal elements(Zr, Hf, La, Gd, Y, Al, Ti).

In addition to the Zirconium oxide film, the metal in metal oxide film 3can be, but is not limited to, tantalum oxide film, titanium oxide film,lanthanum oxide film, hafnium oxide film, gadolinium oxide film, yttriumoxide film and aluminum oxide film. Further, it is possible to use ametal oxide film containing two or more of the above metal elements (Zr,Ta, ti, La, Hf, Gd, Y, Al).

A manufacturing method of a semiconductor device according to the firstembodiment, which includes a gate electrode manufacturing process by adamascene gate process, will now be explained with references to FIGS.2A to 2I.

A damascene gate process is a process in which a dummy gate is firstformed. This dummy gate is later replaced by a gate electrode on a gateforming region of the surface of the semiconductor substrate in whichsource and drain regions are formed. The dummy gate is subsequentlywholly surrounded by an insulating film and both the dummy gate and theinsulating film are treated by a Chemical Mechanical Polishing (“CMP”)method so that the dummy gate and the insulating share a common flatsurface. The dummy gate exposed in the insulating film is removed toform a groove in the form of a target gate electrode in the insulatingfilm, and a gate electrode material is filled into the groove after agate insulating film is formed at the bottom surface of the groove.Finally, the gate electrode material filled in the groove is treated bythe CMP method to form the target gate electrode. This damascene processis further explained below.

First, as shown in FIG. 2A, a silicon oxide film 7 with a film thicknessof about 3 nm is formed by a thermal oxidation method on the surface ofa silicon substrate 1 on which element isolation regions (not shown) isformed by a Shallow Trench Isolation (“STI”) technique. A polysiliconfilm 8 with a film thickness of approximately 50 nm and a siliconnitride film 9 with a film thickness of approximately 30 nm aredeposited by a Low Pressure Chemical Vapor Deposition (“LPCVD”) method.

As shown in FIG. 2B, silicon nitride film 9 and polysilicon film 8 areselectively removed by lithography technique and Reactive Ion Etching(“RIE”) method, so that a dummy gate pattern 10 is formed on a region ofsubstrate 1 on which a gate electrode is to be formed.

As shown in FIG. 2C, a silicon oxide film 11 is formed on side walls ofpolysilicon film 8 by thermal oxidation at approximately 1000° C. Then,arsenic (“As”) ion implantation is effected in an acceleration voltageof approximately 15 keV and does amount of about 5×10¹⁴ cm⁻², forexample, to form source and drain extension regions 12 in self-alignmentwith dummy gate pattern 10.

As can be seen in FIG. 2D, after a Rapid Thermal Anneal (“RTA”) processis effected at about 800° C. for about ten seconds, a silicon nitridefilm 13 with a film thickness of about 10 nm and a silicon oxide film 14with a film thickness of about 50 nm are deposited on the entire surfaceby the LPCVD method. Then, by effecting the etch-back process, sidewalls of silicon oxide film 14 with the form shown in FIG. 2D areformed.

As can be seen in FIG. 2E, arsenic (“As”) ion implantation is effectedin an acceleration voltage of approximately 35 keV, dose amount of about5×10¹⁵ cm⁻², and an RTA process at approximately 1035° C. for about tenseconds to form source and drain diffusion regions 15 superimposed onextension regions 12.

In FIG. 2F, a silicon oxide film 16 with a film thickness ofapproximately 100 nm is deposited on the entire surface and is thenflattened by using a CMP method to expose the upper portion of dummygate pattern 10.

Subsequently, silicon nitride film 9 of dummy gate pattern 10 in FIG. 2Gis removed by using hot phosphoric acid. Polysilicon film 8 is thenremoved by dry etching. Further, the channel ion implantation processand activation annealing process are effected to adjust the thresholdvoltage of a transistor being formed with respect to dummy gate pattern10. Then, the part of silicon oxide film 7 exposed at the bottom of thewalls of silicon nitride film 13 is removed by using a dilutedhydrofluoric acid solution to expose the corresponding part of thesurface of silicon substrate 1 which will be used as a channel region.

Next, in FIG. 2H, a zirconium silicate film 6 with a film thickness ofapproximately 1.5 nm is formed by LPCVD using zirconium chloride(ZrCl₄), tetraethoxysilane (TEOS, Si(OC₂H₅)₄) and O₂, N₂O, NO, or H₂O,which is an oxidant. After the resultant structure is subjected to theannealing process at approximately 800° C. for about 30 seconds, azirconium oxide film 3 with a film thickness of approximately 3 nm isdeposited on the resultant structure by LPCVD using zirconium chloride(ZrCl₄) and O₂, N₂O, NO, or H₂O, which is an oxidant.

As finally shown in FIG. 2I, a titanium nitride film 4 with a filmthickness of approximately 10 nm and a tungsten film 5 with a filmthickness of approximately 100 nm are deposited on the entire surface.Fluorine is ion-implanted at an acceleration voltage of approximately 30kev and a dose amount of approximately 1×10¹⁵ cm⁻² to dope fluorine intotungsten film 5.

The resultant structure is finally subjected to planarization by CMP ina non-oxidizing atmosphere (for example, nitrogen or argon atmosphere),the annealing process is effected at a temperature of approximately 500°C. to 650° C. By this annealing process, fluorine that was doped intotungsten film 5 is diffused and segregated into zirconium silicate film6 which was subsequently formed on the interface with silicon substrate1.

Finally, the structure depicted in FIG. 1A is formed. Subsequently,procedures such as wiring process are executed to complete theproduction of a transistor.

The thickness of the metal oxide film and the metal silicate film on theinterface region obtained in accordance with the teaching of the firstembodiment of the present invention when converted into the filmthickness of the silicon oxide film, can be made equal to or less thanabout 1 nm. Specifically, in order to obtain this desired filmthickness, the metal silicate film formed has a dielectric constantlarger than that of the silicon oxide film and silicon oxide-nitridefilm (SiON film) and was then deposited on the interface region betweenthe metal oxide film (which is the film with a large dielectricconstant) and a part of the silicon substrate acting as a channelregion.

Further, the dangling bond on the interface of the silicon substrate canbe terminated by doping fluorine into the metal silicate film in orderto obtain a good interfacial characteristic. Therefore, an unstablebonding factor between molecules on the interface is reduced. Inaddition, the interface state density can also be lowered to a levelless than that of the normal metal silicate film not doped in fluorine.

Therefore, a high-performance transistor is provided in which theeffective film thickness of the gate insulating film formed from themetal oxide film and metal silicate film can be made extremely smallwith a reduced leak current that is devoid of short channel effect.

In accordance with this embodiment, further explanation is provided forthe damascene gate process having a low temperature heating step afterthe formation of gate insulating films 6 and 3 and metal gate electrodes4 and 5 are formed, but if a normal transistor forming process in whicha polysilicon film is used as the gate electrode instead of the metalgage electrode is used, the same effect can be attained.

Further, in this embodiment, a laminated structure of metal oxide film 3and metal silicate film 6 is used as the gate insulating film, but as amodification shown in FIG. 1B, it is possible to use a single-layeredfilm of metal silicate film 6.

Further, nitrogen can be contained in metal silicate film 6 instead ofdoping fluorine. Further, both fluorine and nitrogen can be contained inmetal silicate film 6. Since the other portions are the same as thoseshown in FIG. 1A, they are denoted by the same reference numerals anddetailed explanation thereof is omitted here. The effect of nitrogendoping will be explained in embodiment 2.

When nitrogen is contained in metal silicate film 6, it is preferable toset the amount of nitrogen contained in metal silicate film 6 to aboutfrom 1×10¹⁴ cm⁻² to about 1×10¹⁵ cm⁻² when the total number of atoms isexpressed in terms of surface density. Particularly, it is desirable toset the number of atoms so as to have the concentration peak in aposition near the interface with silicon substrate 1.

Embodiment 2

FIG. 3 is a cross sectional view of a semi-conductor device according toa second embodiment of this invention. The basic structure is similar tothat of the embodiment 1 shown in FIG. 1A and portions of FIG. 3 whichcorresponds to those of FIG. 1A are denoted by the same referencenumerals.

In the embodiment shown in FIG. 3, a zirconium silicate film 6 is formedonly on the surface of a substrate 1, the film thickness thereof isapproximately 1.5 nm, the film thickness of a zirconium oxide film 3 isapproximately 3 nm, the film thickness obtained by converting the filmthickness of each of these films into the film thickness of a siliconoxide film is approximately 0.5 nm and the total effective gateinsulating film thickness is approximately 1 nm. In this embodiment, asmall amount of nitrogen instead of fluorine is contained in zirconiumsilicate film 6 between the gate electrode and silicon substrate 1. Thewidth of the gate electrode is approximately 50 nm.

It is preferable to set the amount of nitrogen contained in zirconiumsilicate film 6 to about from 1×10¹⁴ cm⁻² to about 1×10¹⁵ cm⁻² when thetotal number of atoms is expressed in terms of the surface density.Particularly, it is desirable to set the number of atoms so as to havethe concentration peak in a position near the interface with siliconsubstrate 1.

Similar to embodiment 1, it is possible to use various types of metalsilicate films and metal oxide films instead of zirconium silicate film6 and zirconium oxide film 3.

Next, a manufacturing method of a semiconductor device according toembodiment 2, as described, above will now be explained in detail withreference to FIGS. 4A to 4D. Since the manufacturing method ofembodiment 2 is the same as that of embodiment 1 up to the step of FIG.2G, only the subsequent processes are explained here.

After the step shown in FIG. 2G, as can be seen FIG. 4A, a siliconoxide-nitride film (SiON) 18 with a film thickness of approximately 0.7nm is formed only on the exposed surface of silicon substrate 1.

Next, as shown in FIG. 4B, a zirconium oxide film 19 with a filmthickness of approximately 1 nm is deposited on the entire surface byLPCVD using zirconium chloride (ZrCl₄) and O₂ or H₂O.

Then, as shown in FIG. 4C, a zirconium silicate film 6 with a filmthickness of approximately 1.5 nm containing nitrogen is formed only onthe bottom surface of a groove in which a gate electrode is to be formedby effecting the annealing process at about 800° C. for about 30 secondsto react silicon oxide-nitride (SiON) film 18 with zirconium oxide film19.

After this, as evident in FIG. 4D, a zirconium oxide film 3 with a filmthickness of approximately 3 nm is deposited on the resultant structureby LPCVD using zirconium chloride (ZrCl₄) and O₂, N₂O, NO, or H₂O, whichis an oxidant. Thus, oxygen deficiency in zirconium oxide film 3 whichoccurs immediately after formation of the film is compensated byeffecting the annealing process in an ozone atmosphere at a temperatureof about 400° C. for approximately three minutes.

Next, a titanium nitride film 4 which a film thickness of approximately10 nm and a tungsten film 5 with a film thickness of approximately 100nm are deposited on the entire surface and then the resultant structureis subjected to planarization by CMP and thus, the structure shown inFIG. 3 is formed. After this, normal procedures including wiring processor the like are successively effected in order to complete a transistor.

Also, in embodiment 2, similar to embodiment 1, by forming metalsilicate film 6 on the interface region between metal oxide film 3 andsilicon substrate 1, the film thickness of the film on the interfaceregion obtained when converted into the film thickness of a siliconoxide film, can be made equal to or less than 1 nm.

Further, since the dielectric constant of metal silicate film 6 can beincreased by doping nitrogen into metal silicate film 6, the physicalfilm thickness of the gate insulating film can be made smaller and theperformance of the transistor can be enhanced. In addition, theoxidizing reaction on metal silicate film 6/silicon substrate 1interface by the oxidant can be suppressed in the annealing processunder the oxidizing atmosphere in order to compensate for the oxygendeficiency in metal oxide film 3 by doping nitrogen into metal silicatefilm 6. As a result, the effective film thickness of the gate insulatingfilm can be made smaller, an increase in the interface level in thelow-temperature oxidation step can be suppressed to a low level and agood interfacial characteristic can be attained.

Therefore, a high-performance transistor can be provided in which theeffective film thickness of the gate insulating film formed on metaloxide film 3 and metal silicate film 6 can be made extremely small, aleak current is reduced and the short channel effect can be suppressed.

In this embodiment, a laminated structure of metal oxide film 3 andmetal silicate film 6 is used as the gate insulating film, but like themodification shown in FIG. 1B, it is possible to use a single-layeredfilm of the metal silicate film and cause the metal silicate film tocontain nitrogen. Further, a transistor forming process can be usedinstead of the described damascene gate process.

Also, it is possible for metal silicate film to contain a proper amountof fluorine and nitrogen as in the first embodiment.

Further, in embodiment 2, zirconium oxide film 3 and zirconium silicatefilm 6 are formed by the use of the same metal of zirconium when thelaminated structure of metal oxide film 3 and metal silicate film 6 isformed as the gate insulating film. However, it is possible to usedifferent metals for forming films 3 and 6, for example to form atantalum oxide film and zirconium silicate film, for example.

Thus, in this invention, since the metal oxide film is deposited afterthe metal silicate film is deposited, instead of forming the metalsilicate film on the interface between the silicon substrate and themetal oxide film by heat treatment after the metal oxide film is formed,the main constituent metal of the metal oxide film and the mainconstituent metal of the metal silicate film can be made different fromeach other. Therefore, a good interfacial characteristic can be attainedby the use of a stable metal silicate film and a metal oxide film havinga large dielectric constant formed on the metal silicate film.

As will be explained in detail later, both metal oxide and metalsilicate films can be formed into an amorphous form by effecting heattreatment at a temperature lower than the crystallization temperature ofthe metal silicate film and higher than the crystallization temperatureof the metal oxide film after depositing the metal silicate film andthen depositing the metal oxide film. Therefore, it is possible toattain a transistor with a local variation in the reduction of effectivefilm thickness that is caused by the dependency of the dielectricconstant on the crystal plane orientation and which has less variationin the threshold voltage and is excellent in reliability. In a casewhere the laminated structure of the metal oxide film and metal silicatefilm is used as the gate insulating film, it is sufficient, if at leastone of the above films is formed in an amorphous form, or both of thefilms are amorphous as described above. When only one of the metal oxidefilm and the metal silicate film is formed into the amorphous form, itis possible to set the temperature for the thermal treatment thereof ata value higher or lower than the crystallization temperature.

Further, in a case where the laminated structure of the metal oxide filmand metal silicate film is formed by using different metals, at leastone fluorine and one nitrogen can be introduced into the metal silicatefilm, as taught in the first embodiment. Additionally, normal transistorforming processes can be used instead of the damascene gate process. Inthis case, however, the metal oxide film may be crystallized in somecases.

Further, a single film structure of the metal silicate film may be usedinstead of using a gate insulating film of the laminated structure ofthe metal silicate film and the metal oxide film. Further, as in thefirst embodiment, it is possible to contain fluorine instead of nitrogenin the metal silicate film or to contain both fluorine and nitrogen inthe metal silicate film.

When the metal silicate film contains fluorine, it is preferable to setthe number of atoms for each unit volume at about from 1×10¹⁹ cm⁻³ toabout 1×10²¹ cm⁻³ as the amount of fluorine contained in metal silicatefilm 6. Particularly, it is desirable to set the number of atoms havingthe concentration peak from about 5×10¹⁹ cm⁻³ to about 5×10²⁰ cm⁻³ in aposition of metal silicate film 6 near the interface with siliconsubstrate 1. The advantages of doping fluorine into the metal silicatefilm have been explained in the description of the first embodiment.

Embodiment 3

The structure and manufacturing process of a semiconductor deviceaccording to an embodiment 3 of this invention will now be explained.The basic structure is similar to that of embodiment 2 shown in FIG. 3,except that the constituent material of the gate insulating film isamorphous. Embodiment 3 will now be explained with reference to FIG. 3.

Like embodiment 2, embodiment 3 uses zirconium oxide film as a metaloxide film 3 and a zirconium silicate film as a metal silicate film 6.The film thickness of zirconium silicate film 6 is approximately 1.5 nm,the film thickness of zirconium oxide film 3 is approximately 3 nm, thefilm thickness obtained by converting the film thickness of each of theabove films 3 and 6 into the film thickness of a silicon oxide film isapproximately 0.5 nm and the effective gate insulating film thickness isapproximately 1 nm. The width of the gate electrode is approximately 50nm.

Similar to embodiment 2, it is possible to use various types of metalsilicate films and metal oxide films instead of zirconium silicate film6 and zirconium oxide film 3.

Next, a manufacturing method of the semiconductor device according tothe embodiment 3 is explained. Since the manufacturing method is thesame as that of embodiment 2 up to the gate insulating film forming stepand only differs in that the gate insulating film material sicrystalline or amorphous, the succeeding process is explained by usingthe same drawings (FIGS. 4A to 4D).

After the step shown in FIG. 2G, as shown in FIG. 4A, an amorphoussilicon oxide-nitride film 18 with a film thickness of approximately 0.7nm is formed on the exposed surface of silicon substrate 1.

Next, as shown in FIG. 4B, a zirconium oxide film 19 with a filmthickness of approximately 1 nm is deposited by LPCVD usingtetra-tertiary butoxyzirconium (Zr(t-OC₄H₉)₄) and O₂ or H₂O.

Then, as shown in FIG. 4C, an amorphous zirconium silicate film 6 with afilm thickness of approximately 1.5 nm is formed only on the bottomsurface of a groove by effecting the annealing process at about 800° C.for about 30 seconds.

After this, as shown in FIG. 4D, an amorphous zirconium oxide film 3with a film thickness of approximately 3 nm is deposited by LPCVD usingtetra-tertiary butoxyzirconium (Zr(t-OC₄H₉)₄) and O₂ or H₂O.

Next, a titanium nitride film 4 with a film thickness of approximately10 nm and a tungsten film 5 with a film thickness of about 100 nm aredeposited on the entire surface and then the resultant structure issubjected to planarization by CMP. Thus, the structure shown in FIG. 3is formed. After this, regular procedures including wiring process orthe like are effected to complete the making of a transistor. Since thewiring process is normally effected at a temperature lower than about500° C., zirconium oxide film 3 can be kept in an amorphous state.

Thus, in embodiment 3, as is in embodiment 2, by forming the metalsilicate film on the interface region between the metal oxide film andthe silicon substrate, the thickness of the film on the interface regionwhen converted into the film thickness of a silicon oxide film, can bemade equal to or less than about 1 nm and a good interfacialcharacteristic can be attained.

Therefore, a high-performance transistor is provided in which theeffective film thickness of the gate insulating film formed from themetal oxide film and metal silicate film can be made extremely small, aleak current reduced, and short channel effect averted.

Further, since both metal oxide film and metal silicate film can beformed in an amorphous form, it is possible to attain a transistor inwhich a local variation in the effective film thickness caused by thedependency of the dielectric constant on the crystal plane orientationcan be reduced and which has a less variation in the threshold voltageand is excellent in the reliability.

In embodiment 3, as in the first and second embodiments, it is possibleto introduce one or both fluorine and/or nitrogen into the metalsilicate film. The amount of fluorine and/or nitrogen can be set in amanner similar to those in the first and second embodiments. Further, atransistor forming process can be used instead of the damascene gateprocess. In this case, however, the metal oxide film may be crystallizedin some instances.

Embodiment 4

Embodiment 4 of the present invention will now be explained withreference to FIGS. 5A to 5H and 6.

FIGS. 5A to 5H are cross sectional views of the respective steps of amanufacturing method of a semiconductor device according to embodiment 4of the present invention.

First, as shown in FIG. 5A, arsenic (“As”) is implanted ionically into asilicon substrate 101 and the thermally diffused to form an N-typeregion 102 with a depth of approximately 1 μm.

As shown in FIG. 5B, a silicon oxide film with a film thickness ofapproximately 600 nm is buried in a preset region to form an elementisolation region 103 of a Shallow Trench Isolation (“SIT”) structure.

Next, as shown in FIG. 5C, a protection oxide film 104 with a filmthickness of approximately 10 nm is formed. After this, an impurity ion105 for adjusting the threshold voltage of a transistor is doped.

After the removal of protection oxide film 104, as shown in FIG. 5D, asilicon oxide-nitride film (SiON film) 106 with a film thickness ofapproximately 1 nm is formed. Next, a metal oxide film (which is a filmwith large dielectric constant) 107 formed of gadolinium oxide (GdO_(x))with a film thickness of approximately several nm is formed by CVD orthe like. The metal oxide film formed by CVD or the like is a coarsefilm that is generally different from a stoichiometric composition.Therefore, in order to make metal oxide film 107 closer to thestoichiometric composition, an oxidation process (heat treatment) isapplied. The oxidation process is applied so as to selectively oxidizeonly oxide film 107 without oxidizing the silicon on the surface ofsilicon substrate 101. For this purpose, the heat treatment is appliedin an atmosphere containing two kinds of gases having differentoxidizing strengths. Specifically, the heat treatment is applied underan atmosphere containing water vapor (H₂O) which is an oxidant andhydrogen (H₂) which is a reductant.

FIG. 6 shows an equilibrium hydrogen-water vapor partial pressure curvefor oxidation of silicon (Si) and gadolinium (Gd). Since the standardfree energies of a silicon oxide film and a metal oxide film aredifferent from each other, an atmosphere which exhibits an oxidizingproperty for the metal oxide film and a reducing property for thesilicon oxide film can be formed by adequately selecting the appropriatepartial pressure of hydrogen and water vapor. Only gadolinium can beoxidized without oxidizing silicon by applying heat treatment in thehatched region shown in FIG. 6 according to the thermodynamiccalculation based on Gibbs free energy.

By effecting the heat treatment in the above-described condition,gadolinium oxide (GdO_(x)) alone can be made closer to thestoichiometric composition without forming a silicon oxide film on theinterface region and a dense metal oxide film 107 can be obtained.Therefore, it is possible to provide a gate insulating film which hasless of a leak current and excellent characteristics without increasingthe physical film thickness of the gate insulating film. If siliconoxide is formed on the surface of the silicon substrate, the siliconoxide can be reduced by the above-mentioned heat treatment.

Next, as shown in FIG. 5E, a polysilicon film 108 with a film thicknessof approximately 150 nm is deposited by using CVD or the like.Polysilicon film 108 is selectively etched with a photoresist as a maskto form a desired gate form.

After this, as shown in FIG. 5F, boron fluoride (BF₂) is implantedionically under condition of an accelerated voltage of about 10 kev anddose amount of about 5×10¹⁴ cm⁻² with the gate electrode (polysiliconfilm 108) as a mask to form source and drain extension regions 109 (LDDregions). Extension region 109 has an effect of alleviating the pnjunction electric field to suppress generation of hot electrons.

Next, as shown in FIG. 5G, a silicon oxide film (SiO₂ film) which isused as a liner layer 110 is deposited to a film thickness ofapproximately 10 nm by using LPCVD or the like. A silicon nitride film(SiN film) 111 is subsequently deposited to a film thickness ofapproximately 50 nm by using LPCVD or the like.

After this, as shown in FIG. 5H, silicon nitride (SiN) film 111 isselectively etched by RIE method to leave parts of silicon nitride (SiN)film 111 only on the gate side walls. Linear layer 110 plays the role ofan etching stopper when RIE is applied. Then, boron (B) is implantedionically under an accelerated voltage of approximately 5 keV and thedose amount of about 5×10¹⁵ cm⁻² so as to form a high-concentrationdiffusion layer of the source and drain. Further, the annealing processfor activation is applied at about 1000° C. for approximately tenseconds. Next, although not shown in the drawings, an interlayerinsulating film, contacts, upper wirings and the like are formed.

Liner layer 110 is removed after the process step shown in FIG. 5H.

Thus, the metal oxide film of dense material can be formed and theprocess described above can be applied to the formation of a metal oxidefilm of in the embodiments 1 to 3.

Embodiment 5

FIGS. 7A to 7F are cross sectional views of the respective steps of amanufacturing method of a semiconductor device according to embodiment 5of the present invention.

First, like embodiment 4, an element isolation region 122 is formed onsilicon substrate 121. Then, as shown in FIG. 7A, a dummy gate 123 isformed on a region on which a gate is to be formed later. Dummy gate 123can be formed with any structure if it can provide etching selectivitywith respect to an interlayer insulating film. However, in thisembodiment, dummy gate 123 is formed as follows.

First, a thermal oxide film 124 (i.e., silicon oxide film) with a filmthickness of approximately several nm is formed and a polysilicon film125 and silicon nitride film (SiN film) 126 are formed by CVD. Then,silicon nitride film (SiN) film 126 is processed into a desired formusing a photoresist as a mask. After the photoresist is removed,polysilicon film 125 and thermal oxide film 124 are etched with siliconnitride film (SiN) 126 as a mask to form dummy gate 123.

Next, as shown in FIG. 7B, boron (B) is implanted ionically under anaccelerated voltage of about 5 keV and dose amount of about 5×10¹⁵ cm⁻²with dummy gate 123 as a mask so as to form a high-concentrationdiffusion layer 127 of the source and drain.

After this, as shown in FIG. 7C, an interlayer insulating film 128 isdeposited by using CVD. Further, the resultant structure is flattened byCMP to expose the upper surface of dummy gate 123.

Next, as shown in FIGS. 7C and 7D, the exposed dummy gate 123 is removedby wet etching or dry etching.

Then, after a pre-process such as an application of diluted hydrofluoricacid, a silicon oxide-nitride (SiON) film 129 with a film thickness ofapproximately 1 nm is formed by using of an oxidizing-nitriding processshown in FIG. 7E. Further, a metal oxide film 130 formed of gadoliniumoxide (GdO_(x)) with a film thickness of approximately several nm isformed by using CVD or the like. Then, like embodiment 4, heat treatmentis effected in an atmosphere containing two kinds of gases havingdifferent oxidizing powers, specifically, an atmosphere containing watervapor and hydrogen. Thus, like embodiment 4, only metal oxide film 130is selectively oxidized without silicon being oxidized on the surface ofsilicon substrate 121. As a result, gadolinium oxide (GdO_(x)) alone canbe made closer to the stoichiometric composition and the dense metaloxide film 130 can be formed without forming a silicon oxide film on itsinterface region. Therefore, a gate insulating film with a less leakcurrent and excellent characteristics can be obtained attained withoutincreasing the physical film thickness of the gate insulating film.

Next, as shown in FIG. 7F, a gate electrode material such as aluminum isdeposited by CVD and subsequently flattened by CMP to form a gateelectrode 131. After this, contacts and upper wirings are formed.

The fourth and fifth embodiments have been explained. However, theseembodiments can also be modified as follows.

In the above embodiments, an atmosphere containing water vapor andhydrogen is used as an example of an atmosphere containing two kinds ofgases having different oxidizing strength. However, the heat treatmentin these atmospheres can also be applied in an atmosphere containingcarbon monoxide (CO) and carbon dioxide (CO₂). In this case, carbondioxide acts as an oxidant and carbon monoxide acts as a reductant.

Further, in the previous embodiments, a laminated structure of a siliconoxide-nitride film and metal oxide film is used as the gate insulatingfilm, but a metal silicate film can also be used instead of the metaloxide film. Additionally, a single-layered film of a metal oxide film ormetal silicate film can be used as the gate insulating film. Moreover, alaminated structure having a metal oxide film formed on the metalsilicate film can also be used. In these instances, a dense metal oxidefilm or metal silicate film can be formed by applying heat treatmentunder an atmosphere containing two kinds of gases having differentoxidizing strengths.

In these embodiments, gadolinium is used as a metal element contained inthe metal oxide film, but it is sufficient if at least one of the metalelements is selected from the group consisting of zirconium, gadolinium,hafnium, lanthanum, yttrium, aluminum, and titanium and is contained inthe metal oxide film or metal silicate film.

Embodiment 6

Embodiment 6 of the present invention will now be explained withreference to FIGS. 8A to 8C in the accompanying drawings. Thisembodiment directs to a method for forming a metal silicate film as agate insulating film structure.

FIGS. 8A to 8C are cross section views of each respective steps of amanufacturing method of a semiconductor device according to embodiment 6of the present invention.

First, as shown in FIG. 8A, an element isolation region 202 is formed ina silicon substrate 201. Then, a silicon oxide film 203 with a filmthickness of approximately 2 nm is formed by either dry or wetoxidation. Further, a zirconium film with a film thickness ofapproximately 100 nm is formed as metal film 204 by plating orsputtering. If plating is used, zirconium film 204 is formed by applyingelectrolysis in a zirconium sulfate (Zr(SO₄)₂.4H₂O) solution after alayer of seed zirconium is formed. By plating, zirconium film 204 thusformed has a high controllability and productivity.

Second, as shown in FIG. 8B, heat treatment is applied in an inert gasatmosphere in order to avoid crystallization.

By applying heat treatment, oxidation/reduction reaction and mutualdiffusion occur in the interface between silicon oxide film 203 andzirconium film 204 to form a zirconium silicate film 205 with a filmthickness of approximately 4 nm (which corresponds to approximately 1 nmin terms of film thickness of silicon oxide film). It is known that anoxide film is formed on the surface of zirconium by using a small amountof oxygen and zirconium which is highly resistant to oxidation (forexample, the first ionization potential ΔE of copper is approximately7.73 (eV), but that of zirconium is approximately 6.84 (eV). Therefore,the surface of zirconium film 204 is easily oxidized in air and anoxidized-zirconium film 206 is formed.

When the surface of zirconium film 204 is oxidized to some extent, theoxidation does not further proceed and the internal portion of zirconiumfilm 204 keeps the metal state in the heat treatment in a gentlecondition. Therefore, the internal zirconium can be used as anelectrode. Alternatively, zirconium oxide film 206 is removed by usingsulfuric acid or hydrofluoric acid, zirconium film 204 is removed byusing hydrogen peroxide solution or the like, and a new metal film isformed on zirconium silicate film 205, which was left behind. In thisembodiment, when zirconium film 204 is not removed and used as anelectrode is explained.

After zirconium silicate film 205 is formed, a silicon nitride film (SiNfilm) 207, which is a cap insulating film with a film thickness ofapproximately 200 nm is formed on the entire surface as shown in FIG.8C. Then, silicon nitride film (SiN) 207, zirconium film 204 and thelike are patterned into a gate electrode. Next, impurity is implantedionically with gate electrode as a mask and the doped impurity isactivated to form source and drain diffusion layer 211.

After this, silicon nitride (SiN) film 208 used as a spacer is formedand the substrate surface is exposed by RIE. Silicon nitride (SiN) film209 acting as a liner layer and which is used as a barrier at the timeof formation of a Boro Phospho Silicate Glass (“BPSG”) film 210 and as astopper at the time of the RIE process are formed to a film thickness ofapproximately 15 nm. Further, BPSG film 210 is formed and the density ofBPSG film 210 is increased in a wet oxidation atmosphere atapproximately 800° C. for about 30 minutes. Then, BPSG film 210 isflattened by using CMP with silicon nitride (SiN) films 207 to 209 beingused as a stopper to complete the formation of a transistor.

Thus, according to this embodiment, since the zirconium film is formedon the silicon oxide film and the silicon oxide film and zirconium filmreact with each other by heat treatment to form the zirconium silicatefilm, the zirconium silicate film thus formed has an excellent filmquality and a large dielectric constant which can then be used as thegate insulating film and the zirconium film which is left behind afterthe heat treatment can be used as is as gate electrode so that themanufacturing process can be simplified and the productivity enhanced.

Embodiment 7

FIGS. 9A to 9E are cross section views of respective steps of amanufacturing method of a semiconductor device according to embodiment 7of the present invention. This embodiment uses methods explained inembodiment 6 to form a dual metal transistor having a gate electrodeformed from different types of metals. The constituents corresponding tothose of embodiment 6 are shown in FIGS. 8A to 8C and are denoted by thesame reference numerals.

Like the same process taught and disclosed in embodiment 6, zirconiumfilm 204 is formed on silicon oxide film (not shown) and the heattreatment is applied to react with the silicon oxide film and zirconiumfilm 204 and with each other to form a zirconium silicate film 205 asshown in FIG. 9A.

Then, as shown in FIG. 9B, part of zirconium film 204 is removed.Specifically, a resist pattern is formed on a region on which part ofzirconium film 204 is to be left behind, zirconium oxide film 206 isremoved by using sulfuric acid or hydrofluoric acid with the resistpattern as a mask and zirconium film 204 is removed by using hydrogenperoxide solution or the like. After this, an yttrium film 212 is formedto a film thickness of approximately 100 nm as a metal film differentfrom a zirconium film on the entire surface.

Next, as shown in FIG. 9C, the resultant structure is flattened by CMPmethod. A zirconium oxide film 206 is formed on the surface of thezirconium film 204 and a yttrium oxide film 213 is formed on the surfaceof the yttrium film 212 by exposing the substrate to an atmosphere. Thefirst ionization potential ΔE of yttrium is approximately 6.38 (eV) andyttrium can be easily oxidized in air like zirconium.

Next, as shown in FIG. 9D, a silicon nitride film 207 which is a capinsulating film is formed to a film thickness of approximately 200 nm.Then, silicon nitride film 207, zirconium film 204, yttrium film 212 andthe like are patterned into a gate electrode.

After this, like embodiment 6, source and drain diffusion layers 211,spacer silicon nitride (SiN) films 208, liner silicon nitride (SiN)films 209, BPSG films 210 and the like are formed to complete atransistor having a structure shown in FIG. 9E.

In this embodiment, when the dual metal transistor is formed, the metalsilicate film having an excellent film quality and a large dielectricconstant can be used as the gate insulating film, the manufacturingprocess can be simplified and the productivity thus can be enhanced.

Embodiment 8

FIGS. 10A to 10E are cross section views of respective steps of amanufacturing method of a semiconductor device according to embodiment 8of the present invention. This embodiment utilizes the method explainedin embodiment 7 to form a dual metal transistor having a gate electrodeformed of different types of metals. The constituents corresponding tothose of embodiment 6 are shown in FIGS. 8A to 8C and are assigned samereference numerals.

First, like the process in embodiment 6, as shown in FIG. 10A, azirconium film 204 is formed on a silicon oxide film 203 and a zirconiumoxide film 206 is formed on zirconium film 204.

Next, as shown in FIG. 10B, part of zirconium film 204 is removed. Morespecifically, a resist pattern is formed on a region on which part ofzirconium film 204 is to be left behind, zirconium oxide film 206 isremoved by using sulfuric acid or hydrofluoric acid with the resistpattern as a mask and zirconium film 204 is removed by using hydrogenperoxide solution or the like. After this, an yttrium film 212 is formedto a film thickness of about 100 nm as a metal film different from azirconium film on the entire surface.

Next, as shown in FIG. 10C, the resultant structure is flattened by CMP.After this, heat treatment is applied in an inert gas atmosphere wherecrystallization will not occur. By applying heat treatment,oxidation/reduction reaction and mutual diffusion occur in the interfacebetween silicon oxide film 203 and zirconium film 204 and in theinterface between silicon oxide film 203 and yttrium film 212 torespectively form zirconium silicate film 205 and yttrium silicate film214 with a film thickness of approximately 4 nm (which corresponds toapproximately 1 nm in terms of the film thickness of a silicon oxidefilm). Zirconium oxide film 206 is formed on the surface of zirconiumfilm 204 and a yttrium oxide film 213 is formed on the surface ofyttrium film 212 by exposing the substrate to an atmosphere.

Next, as shown in FIG. 10D, silicon nitride film 207, which is a capinsulating film is formed to a film thickness of about 200 nm. Then,silicon nitride film 207, zirconium film 204, yttrium film 212 and thelike are patterned into a gate electrode form.

After this, like in embodiment 6, source and drain diffusion layers 211,space SiN films 208, liner SiN films 209, BPSG films 210 and the likeare formed to complete a transistor having a structure shown in FIG.10E.

Also, like embodiments 6 and 7, in embodiment 8, when dual metaltransistor is formed, the metal silicate film has an excellent filmquality and a large dielectric constant which can be used as gateinsulating film, the manufacturing process thus can be simplified andthe productivity enhanced.

In embodiments 6 to 8, zirconium and yttrium are taken as examples ofmetal elements contained in the metal silicate film, but it issufficient if at least one of the metal elements are, but not limited tozirconium, gadolinium, hafnium, lanthanum, yttrium, aluminum andtitanium is contained in the metal silicate film.

Further, in embodiments 6 to 8, a single-layered film of the metalsilicate film is used as gate insulating film, but a laminated structureof the metal silicate film and a metal oxide film formed on the metalsilicate film can be used. In this case, after the metal silicate filmis formed by the heat treatment, a metal film which does not react andlies on the metal silicate film is removed and then a metal oxide filmis formed thereon. As the metal oxide film, a film containing at leastone of the above metal elements, tantalum oxide film or abismuth·strontium·titanium oxide (“BSTO”) film can be used.

However, in embodiments 6 to 8, the metal film is formed on the siliconoxide film, but it is not limited to the silicon oxide film. Thus anytype of silicon oxide film series insulating film can be used and, forexample, a metal film can be formed on a silicon oxide-nitride film(SiON film).

In addition, metal used for the gate electrode can be varied and, forexample, a tungsten film can be used or a laminated structure of atitanium nitride (TiN) film which is a barrier metal and a tungsten filmcan also be used.

Embodiment 9

Embodiment 9 of the present invention will now be explained withreference to FIGS. 11A to 11C in the accompanying drawings.

FIGS. 11A to 11C are cross section views of respective steps of amanufacturing method of a semiconductor device according to embodiment 9of the present invention.

First, as shown in FIG. 11A, a silicon oxide film (SiO₂ film) 302 has anextremely small film thickness of approximately 1 nm or less is formedon silicon substrate 301. Then, part of silicon oxide film 302 isselectively removed to provide an area in which silicon oxide film 302is formed on silicon substrate 301 and an area in which silicon oxidefilm 302 is not formed on silicon substrate 301. After this, a metaloxide film 303 containing metal from the group consisting of La, Hf, Zr,Gd or the like is deposited on the entire surface.

Next, as shown in FIG. 11B, the substrate having the above structure issubjected to heat treatment. By adequately selecting the conditions ofthe heat treatment, metal oxide film 303 reacts with silicon of siliconsubstrate 301 to form a metal silicate film 304 in the area in whichsilicon oxide film 302 is removed and a laminated layer of metal oxidefilm 303 and silicon oxide film 302 is left behind in the area in whichsilicon oxide film 302 is not removed.

Subsequently, as shown in FIG. 1C, an electrode film 305 for a gateelectrode formed of titanium nitride (TiN) or the like is formed on theentire surface and then silicon oxide film 302, metal oxide film 303,metal silicate film 304, and electrode film 305 are patterned. Thus,gate electrode structures having gate insulating films whose effectivefilm thicknesses are different from each other can be attained.

Embodiment 10

FIGS. 12A to 12C are cross section views of respective steps of amanufacturing method of a semiconductor device according to anembodiment 10 of the present invention.

Like embodiment 9, silicon oxide film 302 and metal oxide film 303 areformed on silicon substrate 301 as shown in FIG. 12A.

Next, as shown in FIG. 12B, the substrate having the above structure issubjected to heat treatment. By adequately selecting the conditions ofthe heat treatment, for example, by applying the heat treatment at atemperature higher than that of the heat treatment applied effected inembodiment 9, metal silicate films 306 and 307 having differentcompositions of a metal element, oxygen, and silicon can be formed in anarea in which silicon oxide film 302 is removed and an area wheresilicon oxide film 302 is not removed. Metal silicate films 306 and 307thus formed that the oxygen concentration is higher in metal silicatefilm 307 than in metal silicate film 306 and the silicon concentrationis higher in metal silicate film 306 than in the metal silicate film307.

After this, like embodiment 9, an electrode film 305 is formed and thensilicon oxide films 306, 307 and electrode film 305 are patterned asshown in FIG. 12C. Thus, gate electrode structures having gateinsulating films whose effective film thicknesses are different fromeach other can be attained.

Embodiment 11

FIGS. 13A to 13C are cross sectional views of the respective steps of amanufacturing method of a semiconductor device according to embodiment11 of the present invention.

As in embodiment 9, silicon oxide film 302 and metal oxide film 303 areformed on a silicon substrate 301 as shown in FIG. 13A. At this time,the oxygen concentration of metal oxide film 303 is set lower than avalue determined by the stoichiometric ratio.

Next, as shown in FIG. 13B, the substrate having the above structure issubjected to heat treatment. By adequately selecting the conditions(heating temperature, heating time) of the heat treatment, withdifferent insulation film structures film thicknesses of the siliconoxide film, composition ratios of the metal oxide film, and the like,can be formed in an area in which silicon oxide film 302 is removed andan area in which silicon oxide film 302 is not removed, respectively. Inthe area in which silicon oxide film 302 is removed, metal oxide film303 reacts with silicon substrate 301 to form a metal silicate film 308near the surface of silicon substrate 301 and thus a laminated structureof metal silicate film 308 and metal oxide film 303 is obtained.Further, in the area in which silicon oxide film 302 is not removed,metal oxide film 303 reacts with silicon oxide film 302 to form metaloxide film 309 having a composition which is close to the stoichiometricratio.

After this, like embodiment 9, an electrode film 305 is formed and thenmetal silicate film 308, metal oxide films 303, 309, and electrode film305 are patterned as shown in FIG. 13C. Thus, gate electrode structureshaving gate insulating films whose effective film thicknesses aredifferent from each other can be formed.

Embodiment 12

FIGS. 14A to 14C are cross section views of the respective steps of amanufacturing method of a semiconductor device according to embodiment12 of the present invention.

Like embodiment 9, a silicon oxide film 302 and metal oxide film 303 areformed on silicon substrate 301 as shown in FIG. 14A. At this time, theoxygen concentration of metal oxide film 303 is set lower than a valuedetermined by the stoichiometric ratio.

Next, as shown in FIG. 14B, the substrate having the above structure issubjected to heat treatment. By adequately selecting the conditions(i.e., heating temperature, heating time) of the heat treatment, withdifferent insulating film structures, film thicknesses of the siliconoxide film, composition ratios of the metal oxide film, and the like,can be formed in an area in which silicon oxide film 302 is removed andan area where silicon oxide film 302 is not removed. In the area inwhich the silicon oxide film 302 is removed, metal silicate film 310 inwhich the composition ratio of silicon becomes higher in a portioncloser to the surface of silicon substrate 301 is formed. Further, inthe area in which silicon oxide film 302 is not removed, metal oxidefilm 312 having a composition close to the stoichiometric ratio isformed and a metal silicate film 311 is formed near the surface ofsilicon substrate 301.

After this, like embodiment 9, an electrode film 305 is formed and thenmetal silicate films 310, 311, metal oxide film 312, and electrode film305 are patterned as shown in FIG. 14C. Thus, gate electrode structureshaving the gate insulating films whose effective film thicknesses aredifferent from each other can be formed.

Embodiment 13

FIGS. 15A to 15C are cross section views of the respective steps of amanufacturing method of a semiconductor device according to embodiment13 of this invention.

First, as shown in FIG. 15A, a metal oxide film 313 contains metals suchas La, Hf, Zr, or Gd is deposited on silicon substrate 301. Then,silicon ion is doped into metal oxide film 313 by using anion-implantation technique with photoresist 314 being the mask. Thecondition of the ion-implantation is thus set so that the range of theion is to be within metal oxide film 313 and, for example, it is thusset so that the acceleration voltage is set to be approximately 0.5 toabout 1 keV when the thickness of metal oxide film 313 is approximately3 to 5 nm.

Next, as shown in FIG. 15B, photoresist 314 is removed by a plasmaashing process and wet process using an oxidizing medicine solution andthen the heat treatment is applied. By heat treatment, in a region ofmetal oxide film 313 in which silicon is doped, metal oxide film 313 isconverted into a metal silicate film 315 (for example, La₂SiO₅). In aregion of metal oxide film 313 where silicon is not doped, metal oxidefilm 313 is left behind as is. Thus, by first doping the silicon ion inmetal oxide film 313, it is possible to form metal silicate film 315even if the temperature for heat treatment is set at a temperature lowerthan that of the heat treatment applied in embodiment 9.

Next, as in embodiment 9, an electrode film 305 is formed and then metalsilicate film 315, metal oxide film 313, and electrode film 305 arepatterned as shown in FIG. 15C. Thus, gate electrode structures havingthe gate insulating films whose effective film thicknesses are differentfrom each other can be formed.

In the above example, metal oxide film 313 is deposited directly onsilicon substrate 301, but it is possible to form a thin silicon oxidefilm on silicon substrate 301 and then deposit metal oxide film 313 onthe silicon oxide film. In this case, the structure of the gateinsulating film finally obtained is a laminated structure of the siliconoxide film and metal oxide film 313 and metal silicate film 315,respectively, in the region in which ion-implantation is not effectedand the region in which ion-implantation is effected.

Embodiment 14

FIGS. 16A to 16C are cross section views of the respective steps of amanufacturing method of a semiconductor device according to embodiment14 of the present invention.

First, as shown in FIG. 16A, an extremely thin silicon oxide film 316with a film thickness of approximately 1 nm or less is formed on siliconsubstrate 301. Then, metal oxide film 317 containing metal, such as La,Hf, Zr, or Gd, is deposited on silicon oxide film 316. After this, anion-implantation process for implanting ions such as Ar or Si ionicallyis applied with photoresist 318 as a mask. The condition of theion-implantation is set so that the range of the ion is within siliconoxide film 316. Silicon oxide film 316 is then intentionally damaged bythe ion-implantation.

Next, as shown in FIG. 16B, after photoresist 318 is removed, heattreatment is applied. By heat treatment in a region of silicon oxidefilm 316 that is damaged by the ion-implantation process, metal oxidefilm 317 and silicon oxide film 316 react with each other to form ametal silicate film 319. In a region where silicon oxide film 316 is notdamaged, a laminated layer of silicon oxide film 316 and metal oxidefilm 317 is left behind. Since the coupling between silicon and oxygenis weakened by intentional damage given previously to silicon oxide film316, it is possible to form metal silicate film 319 even if thetemperature of the heat treatment is set at a lower temperature thanthat of the heat treatment temperature applied in embodiment 9.

Next, like embodiment 9, electrode film 305 is formed and then metalsilicate film 319, metal oxide film 317, silicon oxide film 316, andelectrode film 305 are patterned as shown in FIG. 16C. Thus, gateelectrode structures having gate insulating films whose effective filmthicknesses are different from each other can be formed.

As discusses, according to embodiments 9 to 14, the effective filmthickness of the gate insulating film can be made smaller by using metaloxide film or metal silicate film as gate insulating film and theeffective film thicknesses of gate insulating film can be madedifferently in a plurality of regions by making the structure of gateinsulating film different in each respective region.

In embodiments 9 to 14, it is sufficient if at least one metal elementis selected from the group consisting of Al, Sn, Sc, Ti, Sr, Y, Zr, Ba,La, Gd, Hf and Ta is contained in the metal oxide film or metal silicatefilm. However, in an example in which metal oxide film or metal silicatefilm is formed by reaction with the silicon oxide film, it is preferableto use a metal other than Sn and Ta among the above listed metal sinceSn and Ta have a reduction property weaker than Si.

Further, in embodiments 9 to 14, the silicon oxide film is used as thesilicon oxide film series insulating film formed on the siliconsubstrate. An example, silicon oxide-nitride film may be used as siliconoxide film series insulating film.

The embodiments of the invention have been explained above, but thisinvention is not limited to the above embodiments. For example, it ispossible to properly combine the structures and manufacturing methodsexplained in all of the above embodiments taught and discloses. Further,this invention can be modified to a varying degree without departingfrom the technical scope thereof.

According to this invention, in a semiconductor device in which a metaloxide film or an insulating film containing metal, silicon and oxygen,for example, a metal silicate film, is used as a gate insulating film,the characteristic, reliability, productivity and the like are enhanced.

1-13. (canceled)
 14. A manufacturing method of a semiconductor devicehaving a gate insulating film formed on a semiconductor substrate, thegate insulating film including first and second different regions,comprising: forming a silicon oxide film series insulating film on thesemiconductor substrate of said first region; forming metal oxide filmson the silicon oxide film series insulating film of said first regionand on the semiconductor substrate of said second region; and forming aninsulating film containing metal, silicon and oxygen by reacting thesilicon oxide film of said second region and silicon of thesemiconductor substrate with each other by the heat treatment.
 15. Amanufacturing method of a semiconductor device having first and secondregions of a gate insulation film on a semiconductor substrate,comprising: forming a metal oxide film on the semiconductor substrate ofone of the first and second regions or on a silicon oxide film seriesinsulating film formed at the remainder of the first and second regions;selectively doping silicon into the metal oxide film formed on one ofthe first and second regions; and converting the metal oxide film dopedwith silicon into an insulating film containing metal, silicon andoxygen.
 16. A manufacturing method of a semiconductor device havingfirst and second regions of a gate insulating film on a semiconductorsubstrate, comprising: forming a silicon oxide film series insulatingfilm at one of the first and second regions on the semiconductorsubstrate; forming a metal oxide film on the silicon oxide film seriesinsulating film; selectively giving damage to the silicon oxide filmseries insulating film formed at the one of the first and secondregions; and forming an insulating film containing metal, silicon andoxygen by reacting the damaged silicon oxide film series insulating filmand the metal oxide film with each other by the heat treatment. 17-18.(canceled)
 19. A manufacturing method of a semiconductor device havingan insulating film containing metal, silicon and oxygen used as at leastpart of a gate insulating film, comprising: forming the insulating filmcontaining metal, silicon and oxygen on a semiconductor substrate; andeffecting the heat treatment in an atmosphere containing plural types ofgases having different oxidizing powers after said forming theinsulating film.
 20. A manufacturing method of the semiconductor deviceaccording to claim 19, wherein the heat treatment is effected in acondition that metal contained in the insulating film containing metal,silicon and oxygen is oxidized while silicon of a boundary regionbetween the semiconductor substrate and the insulating film containingmetal, silicon and oxygen is not oxidized.